Jingke Electronics carries multi-model gold-free packaged chip-level light source unveiled high-tech LED lighting exhibition
[High-tech LED reporter / Wang Cairong] In the third high-tech LED lighting exhibition in 2013, Jingke Electronics (Guangzhou) Co., Ltd. (hereinafter referred to as "Jingke Electronics") showed to many exhibitors: including Chip-level light source products without gold wire package, such as series light source, COB light source, RGB and EMC chip.
So far, Jingke Electronics has been integrated from chips into chip-level light sources and module light sources. It combines its own product technology, product features and development characteristics of the entire industry. It has very strong technical advantages and features, enabling the middle and upper reaches. Companies are better able to cut into the entire market.
"This chip-level light source product will be exhibited in the LED chip manufacturing process, through a new wafer-level process, to complete a part of the traditional packaging process or save the traditional packaging process, so that the final package size of the LED is reduced, and the performance is more stable. The relevant person in charge of Jingke Electronics told reporters at the booth that compared to the flip-chip process, Jingke Electronics' chip-level light source can avoid the use of traditional solid crystal and wire bonding processes to achieve gold-free wire development, in reliability and Performance and cost performance are better under high current impact.
So far, Jingke Electronics has been integrated from chips into chip-level light sources and module light sources. It combines its own product technology, product features and development characteristics of the entire industry. It has very strong technical advantages and features, enabling the middle and upper reaches. Companies are better able to cut into the entire market.
"This chip-level light source product will be exhibited in the LED chip manufacturing process, through a new wafer-level process, to complete a part of the traditional packaging process or save the traditional packaging process, so that the final package size of the LED is reduced, and the performance is more stable. The relevant person in charge of Jingke Electronics told reporters at the booth that compared to the flip-chip process, Jingke Electronics' chip-level light source can avoid the use of traditional solid crystal and wire bonding processes to achieve gold-free wire development, in reliability and Performance and cost performance are better under high current impact.
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