Osram wins patent license for X-Celeprint MicroLED related technology
On March 29, OSRAM disclosed an intellectual property-related news on its official website. OSRAM Opto Semiconductors recently signed a technology and patent license agreement with X-Celeprint, which involves X-Celeprint's Micro-Transfer-Printing (μTP) technology.
X-Celeprint is a wholly-owned subsidiary of XTRION NV, and XTRION NV also includes the famous X-Fab company. They obtained technical licenses from Semprius and began operations in early 2014. The original inventor of microtransfer technology was Professor John Rogers of the University of Illinois at Urbana-Champaign, and subsequently further development at the Seymour Prius.
It is reported that μTP technology, as an advanced micro-assembly technology, enables hundreds of small (optimally sized sub-millimeter) devices to move precisely at the same time.
Using the simplest language to describe micro-transfer technology is to use a flexible stamp in combination with a high-precision motion-controlled printhead, selectively pick up a large array of micro-devices, and print (place) them. On the replacement substrate.
How is it achieved? First, a micro device (chip) is fabricated on a "source" wafer, and then "released" is obtained by removing the sacrificial layer under the semiconductor circuit. Subsequently, a microstructured elastic stamp (matched to the "source" wafer) is used to pick up the micro devices and print (place) the micro devices on the target substrate.
By changing the speed of the printhead, the adhesion between the elastic stamp and the device being printed can be selectively adjusted to ultimately control the assembly process. When the stamp moves faster, the adhesion becomes very large, and the printed components can be "picked" out of the substrate; on the contrary, when the stamp is far away from the bonding interface and moves slowly, the adhesion becomes small. The printed component will "disengage" and then "print" on the receiving surface.
The stamps are designed to perform single pick and print operations and transfer thousands of discrete components, so the process can be processed in large scale.
The technology has been proven in a wide range of "printable" micro devices including lasers, LEDs, solar cells and various IC materials (silicon, gallium arsenide, indium phosphide, gallium nitride and dielectric films including diamond). ) an integrated circuit.
The license agreement signed this time involves Micro-Transfer-Printing (μTP) technology, and this technology belongs to MicroLED related technology, which means OSRAM Opto Semiconductors or Accelerated Layout MicroLED.
In fact, this is not difficult to understand. MicroLED is regarded as the ultimate technology of LED, and the international giants have been laid out, and the scale and participants are increasing.
However, in terms of the industrial chain, the current manufacturers of MicroLEDs have the most chip terminals, mainly LED manufacturers such as Jingdian, Sanan, Osram, Ganzhao Optoelectronics, and Huacan Optoelectronics, followed by Apple, Sony, Google, etc. The terminal displays the factory.
Dr. Martin Behringer, former head of development for OSRAM Opto Semiconductors, said: "With this technology, we will be able to develop LED products that meet the requirements of miniaturization and multi-functionality. In addition, it provides new innovations for quickly and accurately combining different technologies. method."
10.1 Inch Laptop,win10 Laptops,win11 Laptops
Jingjiang Gisen Technology Co.,Ltd , https://www.jsgisentec.com