TSMC Announces $10 Billion in Development of 450mm Wafer Project

TSMC recently announced that it plans to invest a total of US$10 billion in funds to develop a 450mm wafer fab project. It is expected that the project will be officially put into production in 2013. In 2015, TSMC will carry out R&D on 20nm process products and achieve true Mass production. From the previous information, it can be known that TSMC is the second chip factory to announce its 450mm wafer plan (the first one is Intel). If the project can be completed on time, then TSMC's chip production process will greatly exceed Samsung and GlobalFoundires, and close to Intel's level. In the German chip technology forum, the Chief Technical Director of TSMC has mentioned that the construction of a 450mm wafer fab is of great significance for reducing costs.

According to informed sources, TSMC will gradually install a 450mm wafer test production line in the fourth phase of its Fab12 plant, which will be selected in the Hsinchu Science Park in Taiwan. The final volume production line will be gradually installed in the fifth phase of the Fab15 plant.