Huirong chip is at the forefront of the development of vehicle SSD

Memory chip

The advanced driver assistance system uses a variety of sensors installed in the car to sense the surrounding environment, collect data, identify, detect and track static and dynamic objects, and combine navigation maps. Data, the calculation and analysis of the system, so that the driver can detect the danger that may occur in advance, and effectively increase the comfort and safety of the driving of the car. Let's take a look at the related content with the car electronics editor.

In recent years, the ADAS market has grown rapidly. Originally, such systems were limited to the high-end market and are now entering the mid-market. At the same time, many low-tech applications are more common in entry-level passenger vehicles, and new and improved sensor technologies are also being developed. Create new opportunities and strategies for system deployment.

Huirong chip is at the forefront of the development of vehicle SSD

In-vehicle infotainment system (IVI) is becoming more and more popular, advanced driver assistance system (ADAS) and driverless technology are gradually maturing, and the in-vehicle system is advancing rapidly to create increasingly large data processing needs. The required memory capacity and output/input bandwidth are not allowed. Not upgraded accordingly. Not only that, the vehicle storage components have to consider the extremely high reliability and safety of the vehicle requirements compared with the general applications such as 3C electronics, and further incorporate the corresponding mechanisms such as hard/firm firmware debugging and real-time feedback.

Hu Wenji, project manager of SMI's product planning department, the main supplier of memory control chip, said that since the early use of SD card, reticle ROM, PATA/SATA hard disk, etc., the current car system is embedded in 16G. The type of multimedia memory card (eMMC) and the solid state drive (SSD) are the mainstream storage media. The former mainly stores the boot sector and the operating system, and is used as the data storage of some low-end vehicles; the latter mostly stores audio and video, maps, etc. For multimedia information.

With the development of smart vehicles faster and faster, Huirong Product Planning Department's associate letter predicts that from 2020, Universal Flash Memory (UFS) is expected to gradually replace eMMC's current applications, and car SSDs may also slowly shift from PATA/SATA to PCIe. In addition, in view of the stable production capacity of 3D NAND flash memory, NAND suppliers such as Samsung and Micron are gradually increasing the proportion of production. The introduction letter believes that in the capacity and cost considerations, the front-loading market will have 5 to 70% in the future. SSDs are expected to switch to 3D multi-level cell (MLC) and even three-layer cell (TLC) NAND storage technology.

Higher storage densities mean that in-vehicle systems can handle richer content and provide a better user experience, but how to handle data integrity (Data Integrity) when dealing with more information will be critical to the vehicle. According to the briefing, the automotive industry generally has only a few percent tolerance for the IBI application component defect rate (DPPM), and almost zero tolerance for applications such as dashboards and ADAS; for all levels of automated driving systems, more needs such as Error correction code (ECC), cyclic redundancy check (CRC), and to some extent, data path protection (DPP) and other debugging mechanisms, some car manufacturers even require redundant disk array (RAID) function to further enhance reliability.

For the IVI system, which is growing rapidly in the market, and other high-end in-vehicle systems such as ADAS and instrument panel, which have extremely high reliability requirements, the introduction letter indicates that Huirong's control chip has corresponding solutions, including hard/tough adjustment according to the needs of the manufacturer. The body enables the host to monitor the health of storage media such as SSD and eMMC through telematics (Telematics) to prevent data loss under high temperature operation, and to allow the hard/firm body to self-scan at a certain temperature. Reducing potential risks; in response to the latest 3D TLC NAND technology, he also pointed out that the control chip must have a stronger firmware debugging mechanism to reduce DPPM. In addition, in consideration of the increasing confidentiality requirements, Hui Rong also incorporates firmware digital signature, encryption, and even erase functions.

At this stage, Huirong's in-vehicle related solutions, in addition to supporting PATA, SATA, eMMC, and SD card interfaces for post-installation, have also been incorporated into PCIe and UFS interfaces that are regarded as trends; recently, the company will also introduce 3D NAND flash memory. The new solution supports the fourth and fifth generation 3D NAND technologies that will emerge in the next year. On the other hand, the Ferri series memory solution is also the main product of Huirong in automotive applications, and has developed debugging functions such as NANDXtend, IntelligentScan, and end-to-end DPP for high reliability requirements to prevent errors caused by high temperature or dense reading. The situation occurs; there are mechanisms such as low-density parity check code (LDPC) and group page RAID to maximize NAND flash life after debugging.

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