Price war continues to sapphire substrate cutting technology can reduce production costs
The price of LED lighting is constantly fighting. How to reduce the production cost of LED chips has become an important survival key for related chip manufacturers. Laser processing equipment manufacturer Han's laser said that by introducing more advanced UV sapphire substrate cutting technology, LED chip manufacturers can still effectively reduce LED production costs.
Han Bo, director of small-scale laser power marketing, said that LED lighting has continued to be depressed in recent years and is expected to quickly replace traditional fluorescent lamps or power-saving bulbs.
Hanbo, director of the small-scale laser small-power marketing, said that the price of LED lighting has been continuously low in recent years, and it is expected to quickly replace the traditional fluorescent lamps or energy-saving bulbs, effectively driving the LED lighting market prospects; but in order to survive in the highly competitive industries, Operators must constantly improve their operational efficiency.
In view of this, Han's Laser launched a new UV laser slide machine. This slider focuses the laser beam on the surface of the brittle material and instantly cuts the sapphire or glass substrate with the high peak energy of the laser. This machine has the characteristics of fast cutting, high quality and high cutting strength. It is equipped with transparent material penetration technology and is suitable for cutting sapphire and glass substrates with a thickness of 1 mm (mm) or less.
It is worth mentioning that this equipment is equipped with the company's self-developed DRACO ultraviolet laser to provide customers with more quality assurance equipment; and the machine can be red and yellow, silicon substrate wafer cutting; its built-in Auto-focus system for fast cutting focus of the substrate.
At present, the most popular LED substrate is sapphire and GaN-on-Si, but the Han family laser is still optimistic about the prospect of sapphire substrates, and will not enter the field of bismuth-based GaN.
Wenbo said that the company will continue to maintain its existing business and continue to study sapphire materials related technology, and the current LED industry will still give priority to the use of sapphire materials as the main substrate. If bismuth GaN has a higher level of opportunity, the company will also consider the layout of related technologies.
On the other hand, the company also offers special equipment for UV cutting of online printed circuit boards (PCBs). Wenbo explained that compared with the traditional cutting processing method, this PCB cutting machine is non-contact processing, so there is no machine stress and deformation during the process, the generated dust is less, it is not easy to pollute the environment; Processing arbitrary graphics, processing graphics can also be freely converted, not only saves the time to replace the mold, but also reduces costs.
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