Jingke Electronics creates a new trend of flip-chip gold-free chip-level packaging
New technology has always been one of the core driving forces for reducing costs, improving light efficiency and enhancing the competitiveness of enterprises. To a large extent, the upstream chip and midstream packaging technology directly determine the quality of LED lighting products.
In recent years, Jingke Electronics (Guangzhou) Co., Ltd. (hereinafter referred to as "Jingke Electronics") introduced a flip-chip gold-free chip-level package device, creatively combining flip-chip bonding technology with gold-free chip-scale packaging. More stable performance, better heat dissipation, more uniform light color distribution, and smaller volume are favored by more and more LED lighting companies and end product application companies.
Flip-chip LED chip performance upgrade
Jingke Electronics is the first company in China to apply flip-chip soldering technology to LED chips. As early as 2003, Jingke applied for core patents and was authorized in the United States and China for a number of flip-chip bonding technologies.
Compared with the positive chip, the flip-chip solder chip produced by Jingke Electronics has the advantages of low voltage, high brightness, high reliability, high saturation current density, and good heat dissipation. The practice proves that it is easier to realize the ultra-high-power chip-level module and the multi-functional integrated chip light source technology by using the flip-chip welding method, which has great advantages in the yield and performance of the LED chip module. In addition, flip-chip soldering chips can integrate protection circuits on flip-chip substrates, which can significantly improve chip reliability and performance.
Since its establishment, Jingke Electronics has adhered to the independent research and development innovation route and has outstanding core technology advantages. At present, it has more than 70 core technology patents approved by new or preliminary examination. As a leading brand of high-power high-brightness LED integrated chips for mature flip-chip welding technology in China, Jingke Electronics' products are widely used in road lighting, commercial lighting, architectural lighting, automotive lighting, urban lighting, decorative lighting, special lighting and various A field of backlights and the like.
Gold-free wire package leads to miniaturization of packaged devices
At the same time, Jingke Electronics is also the earliest enterprise in China to implement gold-free wire packaging based on flip-chip welding technology. The combination of a chip-scale light source and a flip-chip process enables a true gold-free package that performs better in terms of reliability and high current surge.
Flip-chip gold-free chip-level package, based on flip-chip soldering technology, on the basis of traditional LED chip packaging, reduce the gold wire packaging process, save the lead frame, wire, leaving only the chip with phosphor and package adhesive .
In 2013, Jingke Electronics launched the “chip-level LED lighting overall solutionâ€, which saved some of the traditional packaging process through the new wafer-level process, which made the final package size of the LED shrink and the performance more stable.
As a new packaging technology product, the flip-chip gold-free chip-level light source has no problems such as non-brightness, flicker, and high light decay caused by gold wire soldering or poor contact. Compared with the traditional packaging process, the package density of the chip-scale light source has increased by 16 times, the package size has been reduced by 80%, and the luminaire design space is larger.
The era of flip-chip gold-free packaging
Jingke Electronics has opened up a new trend of flip-chip gold-free packaging. Its star product series include Easy Star (3535), Yi Hui, Yi Xing, Yi Yao and so on. Among them, Yi Xing has been included in the Guangdong Provincial Government Procurement Catalogue, and passed the LM80 certification in 2013 and the Guangdong Standard Optical Component Angular Product Certification. At the same time, the Zhonglong Sichuan Tunnel Project using Yixing products also won the “Global Lighting Project 100â€. Good" honor. The product has been in business for three years since its launch in 2011 and has been updated to the third generation.
In addition, Jingke Electronics' products based on flip-chip process without gold wire package involve high-power single crystal devices, COB modules, mobile phone flash lamps, direct-lit backlights, and optical components.
At present, Jingke Electronics has become the only manufacturing company in mainland China that can realize high-power flip chip, integrated chip, and LED chip-level light source, module light source and light engine without gold wire package. Its R&D capability and market reputation are both Widely recognized by the industry.
In the future, Jingke Electronics will adhere to the leading technology, take the road of professional development, develop the market with advanced technology, promote technological innovation with market demand, and build a high-tech enterprise with international leading level. The company will further increase the production capacity of high-power and high-efficiency LED chip devices, expand the epitaxial wafer and chip production lines by overseas technology transfer methods, expand the semiconductor lighting market, and strive to become a domestic first-class supplier of high-power LED chips, modules and lighting components.
In recent years, Jingke Electronics (Guangzhou) Co., Ltd. (hereinafter referred to as "Jingke Electronics") introduced a flip-chip gold-free chip-level package device, creatively combining flip-chip bonding technology with gold-free chip-scale packaging. More stable performance, better heat dissipation, more uniform light color distribution, and smaller volume are favored by more and more LED lighting companies and end product application companies.
Flip-chip LED chip performance upgrade
Jingke Electronics is the first company in China to apply flip-chip soldering technology to LED chips. As early as 2003, Jingke applied for core patents and was authorized in the United States and China for a number of flip-chip bonding technologies.
Compared with the positive chip, the flip-chip solder chip produced by Jingke Electronics has the advantages of low voltage, high brightness, high reliability, high saturation current density, and good heat dissipation. The practice proves that it is easier to realize the ultra-high-power chip-level module and the multi-functional integrated chip light source technology by using the flip-chip welding method, which has great advantages in the yield and performance of the LED chip module. In addition, flip-chip soldering chips can integrate protection circuits on flip-chip substrates, which can significantly improve chip reliability and performance.
Since its establishment, Jingke Electronics has adhered to the independent research and development innovation route and has outstanding core technology advantages. At present, it has more than 70 core technology patents approved by new or preliminary examination. As a leading brand of high-power high-brightness LED integrated chips for mature flip-chip welding technology in China, Jingke Electronics' products are widely used in road lighting, commercial lighting, architectural lighting, automotive lighting, urban lighting, decorative lighting, special lighting and various A field of backlights and the like.
Gold-free wire package leads to miniaturization of packaged devices
At the same time, Jingke Electronics is also the earliest enterprise in China to implement gold-free wire packaging based on flip-chip welding technology. The combination of a chip-scale light source and a flip-chip process enables a true gold-free package that performs better in terms of reliability and high current surge.
Flip-chip gold-free chip-level package, based on flip-chip soldering technology, on the basis of traditional LED chip packaging, reduce the gold wire packaging process, save the lead frame, wire, leaving only the chip with phosphor and package adhesive .
In 2013, Jingke Electronics launched the “chip-level LED lighting overall solutionâ€, which saved some of the traditional packaging process through the new wafer-level process, which made the final package size of the LED shrink and the performance more stable.
As a new packaging technology product, the flip-chip gold-free chip-level light source has no problems such as non-brightness, flicker, and high light decay caused by gold wire soldering or poor contact. Compared with the traditional packaging process, the package density of the chip-scale light source has increased by 16 times, the package size has been reduced by 80%, and the luminaire design space is larger.
The era of flip-chip gold-free packaging
Jingke Electronics has opened up a new trend of flip-chip gold-free packaging. Its star product series include Easy Star (3535), Yi Hui, Yi Xing, Yi Yao and so on. Among them, Yi Xing has been included in the Guangdong Provincial Government Procurement Catalogue, and passed the LM80 certification in 2013 and the Guangdong Standard Optical Component Angular Product Certification. At the same time, the Zhonglong Sichuan Tunnel Project using Yixing products also won the “Global Lighting Project 100â€. Good" honor. The product has been in business for three years since its launch in 2011 and has been updated to the third generation.
In addition, Jingke Electronics' products based on flip-chip process without gold wire package involve high-power single crystal devices, COB modules, mobile phone flash lamps, direct-lit backlights, and optical components.
At present, Jingke Electronics has become the only manufacturing company in mainland China that can realize high-power flip chip, integrated chip, and LED chip-level light source, module light source and light engine without gold wire package. Its R&D capability and market reputation are both Widely recognized by the industry.
In the future, Jingke Electronics will adhere to the leading technology, take the road of professional development, develop the market with advanced technology, promote technological innovation with market demand, and build a high-tech enterprise with international leading level. The company will further increase the production capacity of high-power and high-efficiency LED chip devices, expand the epitaxial wafer and chip production lines by overseas technology transfer methods, expand the semiconductor lighting market, and strive to become a domestic first-class supplier of high-power LED chips, modules and lighting components.
(This article is the electronic submission of Jingke)
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